GlobalFoundries invests $575M to open semiconductor packaging and photonics center in New York
GlobalFoundries (GF) has announced plans to open a new center for advanced packaging and testing of U.S.-made essential chips within its New York manufacturing facility. The company, which produces semiconductors, will invest $575 million into the New York Advanced Packaging and Photonics Center, generating 100 new jobs in the process. According to GF, the center is designed to enable semiconductors to be securely manufactured, processed, packaged and tested entirely onshore in the United States to meet the growing demand for GF’s silicon photonics and other essential chips. The investment will enable the New York Advanced Packaging and Photonics Center to provide packaging, assembly and testing for GF’s differentiated silicon photonics platform; turnkey advanced packaging, bump, assembly and testing for aerospace and defense customers; and new production capabilities for the advanced packaging, wafer-to-wafer bonding, assembly and testing of 3D and HI chips.
To help aid the project, GF will receive $20 million from New York state, in addition to $550 million from the New York State Green CHIPS program. Additionally, the U.S. Department of Commerce will provide up to $75 million in direct funding to support the center.
What people are saying
In a recent quote, Dr. Thomas Caulfield, president and CEO of GF, said, “We’re proud to partner at the state and federal level on this new center, which is a direct response to our customers asking for more geodiversity in their supply chains and additional support with advanced packaging solutions for GF silicon photonics, Trusted, and 3D/HI offerings. The New York Advanced Packaging and Photonics Center will be unique in our industry and will play a vital role in the continued growth of the Empire State’s world-class semiconductor manufacturing and innovation ecosystem.”
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